No. 35, 35-1 & 35-2,
Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka,
Malaysia.
+606-231 2555
+606-234 4277
+606-234 4277
+606-234 4255
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FEG Components Sdn Bhd
No. 35, 35-1 & 35-2,
Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka,
Malaysia.
No. 35, 35-1 & 35-2,
Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka,
Malaysia.
Branch:
FEG Engineering Sdn Bhd
No. 31-9-32, The CEO,
Lebuh Nipah 5, Bayan Lepas,
11900 Penang, Malaysia.
FEG Components (Ipoh) Sdn Bhd
No. 35, Laluan Pinji Seni 4,
Taman Pinji Seni,
31650 Ipoh,
Perak, Melaysia.
FEG Engineering Sdn Bhd
No. 31-9-32, The CEO,
Lebuh Nipah 5, Bayan Lepas,
11900 Penang, Malaysia.
+604-630 7101
+604-630 7103
FEG Components (Ipoh) Sdn Bhd
No. 35, Laluan Pinji Seni 4,
Taman Pinji Seni,
31650 Ipoh,
Perak, Melaysia.
+605-243 6412
+605-243 6413
+605-243 6413
+605-243 3054
HAD205-P(D)CO
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HAD205-D
Plane-type High-speed Die Bonder
Cycle: 60ms
Compatible with solder-paste printed SMD optocoupler, etc.
Features
1. International leading double die bond and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Automatic chip theta alignment system is applied on the Crystal frame;
5. Vacuum die missing testing technology is adopted;
6. Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing.
Specifications and Parameters
Plane-type High-speed Die Bonder
Cycle: 60ms
Compatible with solder-paste printed SMD optocoupler, etc.
Features
1. International leading double die bond and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Automatic chip theta alignment system is applied on the Crystal frame;
5. Vacuum die missing testing technology is adopted;
6. Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing.
Specifications and Parameters
| 1. Production Cycle | 4. Die Bonder’s Swing Arm-and-hand system | ||
| Production Cycle | 60ms (depending on chip size and bracket) | Die Bonder Swing Arm | 126° Rotatable Die Bond with double arms |
| Accuracy (with die correcting feature) | ± 1mil (±0.025mm) | Die Bond Pressure | 20g – 250g (Adjustable) |
| Die Rotation | ± 1° | 5. Loading Workbench | |
| 2. Chip XY Workbench | Range of Stroke | 100mm*300mm | |
| Chip Dimensions |
5mil×5mil-80mil×80mil (0.13mm*0.13mm-2.0mm*2.0mm) |
XY Resolution | 0.02mil (0.5μm) |
| 6. Suitable Holder Size | |||
| Max. Angle Correction | 360° | Length | 150mm ~ 300mm |
| Max. Chip Ring Size | 6” - 7” | Width | 50mm ~ 100mm |
| Max. Chip Area | 4” (101mm) - 5” (127mm) | 7. Facilities Needed | |
| Resolution Ratio | 0.04mil (1μm) | Voltage/Frequency | 220V AC±5%/50HZ |
| Thimble Z Height Stroke | 80mil (2mm) | Compressed Air | 0.5MPa (MIN) |
| Rated Power | 1000W | ||
| 3. Image Recognition System | Gas Consumption | 5L/min | |
| Image Identification | 256 grayscale | 8. Volume and Weight | |
| Resolution | 656 x 492 pixels | Length x Width x Height | 192 × 85 ×180cm |
| Image Recognition Accuracy |
± 0.025mil@50mil Observation Range |
Weight | 1250kg |