No. 35, 35-1 & 35-2,
Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka,
Malaysia.
+606-231 2555
+606-234 4277
+606-234 4277
+606-234 4255
- Hengstler
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FEG Components Sdn Bhd
No. 35, 35-1 & 35-2,
Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka,
Malaysia.
No. 35, 35-1 & 35-2,
Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka,
Malaysia.
Branch:
FEG Engineering Sdn Bhd
No. 31-9-32, The CEO,
Lebuh Nipah 5, Bayan Lepas,
11900 Penang, Malaysia.
FEG Components (Ipoh) Sdn Bhd
No. 35, Laluan Pinji Seni 4,
Taman Pinji Seni,
31650 Ipoh,
Perak, Melaysia.
FEG Engineering Sdn Bhd
No. 31-9-32, The CEO,
Lebuh Nipah 5, Bayan Lepas,
11900 Penang, Malaysia.
+604-630 7101
+604-630 7103
FEG Components (Ipoh) Sdn Bhd
No. 35, Laluan Pinji Seni 4,
Taman Pinji Seni,
31650 Ipoh,
Perak, Melaysia.
+605-243 6412
+605-243 6413
+605-243 6413
+605-243 3054
HAD308
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HAD 308
Plane-type High Speed Die Bonder
Cycle: 80ms
Compatible with SMD, COB, Diodes, Flip-chip, etc.
Features
1. Internationally leading double die-bonding, double adhesive-dispensing and double die-searching system.
2. Linear motor is applied to drive bond head.
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C).
4. Crystal frame automatic correction chip structure.
5. Programmed control constant-temperature adhesive dispensing system is also applied.
6. Vacuum die missing testing technology is adopted.
7. Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency.
8. IPC will control the equipment, simplifying the equipment operation with user-friendly interfaces.
9. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness.
10. Precise die bond location and excellent compatibility will guarantee the back-end processing.
Specifications and Parameters
Plane-type High Speed Die Bonder
Cycle: 80ms
Compatible with SMD, COB, Diodes, Flip-chip, etc.
Features
1. Internationally leading double die-bonding, double adhesive-dispensing and double die-searching system.
2. Linear motor is applied to drive bond head.
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C).
4. Crystal frame automatic correction chip structure.
5. Programmed control constant-temperature adhesive dispensing system is also applied.
6. Vacuum die missing testing technology is adopted.
7. Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency.
8. IPC will control the equipment, simplifying the equipment operation with user-friendly interfaces.
9. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness.
10. Precise die bond location and excellent compatibility will guarantee the back-end processing.
Specifications and Parameters
| 1. Production Cycle | 4. Die Bonder’s Swing Arm-and-hand system | ||
| Production Cycle | 80ms (depending on chip size and bracket) | Die Bonder Swing Arm | 90° Rotatable Die Bond |
| Accuracy | ± 1mil (±0.025mm£© | Die Bond Pressure | 20g-250g (Adjustable) |
| Die Rotation | ± 1° | 5. Loading Workbench | |
| 2. Chip XY Workbench | Range of Stroke | 300mm*75mm | |
| Chip Dimensions |
5mil×5mil-80mil×80mil (0.13mm*0.13mm-2mm*2mm) |
XY Resolution | 0.02mil (0.5μm) |
| 6. Suitable Holder Size | |||
| Max. Angle Correction | ± 15° | Length | 145mm ~ 300mm |
| Max. Chip Ring Size | 8″/210mm (Outer Diameter) | Width | 40mm~ 75mm |
| Max. Chip Area | 6.5″/165mm (Expanded) | 7. Facilities Needed | |
| Resolution | 0.04mil (1μm) | Voltage/Frequency | 220V AC±5%/50HZ |
| Thimble Z Height Travel | 80mil (2mm) | Compressed Air | 0.5MPa (MIN) |
| Rated Power | 950W | ||
| 3. Image Recognition System | Gas Consumption | 5L/min | |
| Image Identification | 256 grayscale | 8. Volume and Weight | |
| Resolution | 656 x 492 pixels | Length x Width x Height | 175 x 125 x 185cm |
| Image Recognition Accuracy |
± 0.025mil@50mil Observation Range |
Weight | 1470kg |