No. 35, 35-1 & 35-2,
Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka,
Malaysia.
+606-231 2555
+606-234 4277
+606-234 4277
+606-234 4255
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FEG Components Sdn Bhd
No. 35, 35-1 & 35-2,
Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka,
Malaysia.
No. 35, 35-1 & 35-2,
Jalan AKP 1,
Taman Ayer Keroh Permai,
75450 Melaka,
Malaysia.
Branch:
FEG Engineering Sdn Bhd
No. 31-9-32, The CEO,
Lebuh Nipah 5, Bayan Lepas,
11900 Penang, Malaysia.
FEG Components (Ipoh) Sdn Bhd
No. 35, Laluan Pinji Seni 4,
Taman Pinji Seni,
31650 Ipoh,
Perak, Melaysia.
FEG Engineering Sdn Bhd
No. 31-9-32, The CEO,
Lebuh Nipah 5, Bayan Lepas,
11900 Penang, Malaysia.
+604-630 7101
+604-630 7103
FEG Components (Ipoh) Sdn Bhd
No. 35, Laluan Pinji Seni 4,
Taman Pinji Seni,
31650 Ipoh,
Perak, Melaysia.
+605-243 6412
+605-243 6413
+605-243 6413
+605-243 3054
HAD810
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HAD 810
Automatic Plane-type Die Bonder
Cycle: 220ms
Compatible with IC frames
Features
1. Linear motors design enables the application of double adhesive-dispensing bond heads.
2. High-precision linear driving die bond tieback, voice coil torsion loop controls die bonding pressure accurately.
3. High-precision die-platform search system, servo motor drive die-angle correction system, equipped together with an automatic film expansion system.
4. A separate dispensing control system is used to have a precise control over the glue-dispensing amount.
5. Vacuum die missing testing technology is adopted.
6. IPC will control the equipment, simplifying the equipment operation with user-friendly interfaces.
Specifications and Parameters
| 1.Production Cycle | 4.Die Bonder’s Swing Arm-and-hand system | |||
| Production Cycle | 220ms (depending on chip size and bracket) | Die Bonder Swing Arm | 150mm linear motor reciprocate die bonding | |
| Accuracy | ±0.6mil ±0.015mm | Die Bond Pressure | 20g-250g (Adjustable) | |
| Accuracy (Up-look inspection) | ± 1mil ±0.025mm | 5.Suitable Holder Size | ||
| Die Rotation | ± 1° | |||
| 2.Chip XY Table | Length | 110mm ~ 280mm | ||
| Chip Dimensions |
5mil×5mil-100mil×100mil (0.13mm*0.13mm-2.54mm*2.54mm) (If utilizing glue-disk dispensing way, given the die is lesser than 12mil) |
Width | 25mm ~ 110mm | |
| Max. Angle Correction | 360° | 6.Facilities Needed | ||
| Max. Chip Ring Size |
Outer Diameter: 296mm Inner Diameter: 254mm |
Voltage/Frequency | 220V AC±5%/50HZ | |
| Max. Chip Area | 205mm (expanded) | Compressed Air | 0.5MPa（MIN） | |
| Resolution | 0.04mil (1μm) | Rated Power | 1820W | |
| Thimble Z Height Travel | 80mil（2mm) | Gas Consumption | 5L/min | |
|
Suitable Iron ring/ wafer |
Standard Equipped with 10″Iron Ring and 8″Wafer | |||
| Compatible with 8″Iron Ring and 6″Wafer | ||||
| 3.Image Recognition System | Suitable Barrel Spec. |
Standard Equipped with 10CC (Compatible with 5CCand 3CC) |
||
| Image Identification | 256 grayscale | 7.Volume and Weight | ||
| Resolution | 656 x 492 pixels | Length x Width x Height | 205 x 135 x 190cm | |
| Image Recognition Accuracy |
±0.025mil@50mil observation range |
Weight | 1800kg | |